Semiconductor package having a circuit pattern

ABSTRACT

A semiconductor package includes a circuit pattern extending in a horizontal direction. The circuit pattern is conductive. A first insulation layer is disposed on the circuit pattern. A semiconductor chip is disposed on the first installation layer. The first insulation layer includes first protrusions which protrude from a bottom surface of the first insulation layer, penetrate through at least a portion of the circuit pattern, and have a mesh structure. A second protrusion protrudes from the bottom surface of the first insulation layer and penetrates at least a portion of the circuit pattern. The second protrusion is spaced apart from the semiconductor chip in the horizontal direction. The second protrusion has a width in the horizontal direction wider than that of each of the first protrusions.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority under 35 U.S.C. § 119 to Korean PatentApplication No. 10-2017-0102568, filed on Aug. 11, 2017, in the KoreanIntellectual Property Office, the disclosure of which is incorporated byreference herein in its entirety.

TECHNICAL FIELD

Exemplary embodiments of the present inventive concept relate to asemiconductor package, and more particularly, to a semiconductor packagehaving a circuit pattern.

DISCUSSION OF RELATED ART

A package substrate is an electronic component on which electroniccomponents such as semiconductor chips may be mounted. As electronicdevices have increased in capacity, as well as become faster, morefunctional, and smaller in size, package substrates are being developedwith various materials and structures. For example, various types ofpackage substrates are being developed, such as a printed circuit boardincluding a plurality of relatively thin substrates integrated with oneanother, a flexible substrate including a plastic film coated with acopper foil pattern, and a tape substrate.

SUMMARY

An exemplary embodiment of the present inventive concept provides asemiconductor package including a package substrate with enhancedreduced effective coefficient of thermal expansion (CTE)

According to an exemplary embodiment of the present inventive concept, asemiconductor package includes a circuit pattern extending in ahorizontal direction. The circuit pattern is conductive. A firstinsulation layer is disposed on the circuit pattern. A semiconductorchip is disposed on the first insulation layer. The first insulationlayer includes first protrusions which protrude from a bottom surface ofthe first insulation layer, penetrate through at least a portion of thecircuit pattern, and have a mesh structure. A second protrusionprotrudes from the bottom surface, of the first insulation layer andpenetrates at least a portion of the circuit pattern. The secondprotrusion is spaced apart from the semiconductor chip in the horizontaldirection. The second protrusion has a width in the horizontal directionwider than that of each of the first protrusions.

According to an exemplary embodiment of the present inventive concept, asemiconductor package includes a package substrate having a chipmounting region and a non-mounting region defined by the chip mountingregion. The package substrate includes a circuit pattern which extendsin the chip mounting region and the non-mounting region in a horizontaldirection and includes a conductive material. An insulation layer isdisposed on the circuit pattern. A semiconductor chip is disposed on thepackage substrate in the chip mounting region. The non-mounting regionincludes a coefficient of thermal expansion (CTE) adjusting region. Amass ratio of the conductive material in a portion of the packagesubstrate in the CTE adjusting region is smaller than a mass ratio ofthe conductive material in a portion of the package substrate in thechip mounting region.

According to an exemplary embodiment of the present inventive concept, asemiconductor package includes a first circuit pattern extending in ahorizontal direction. The first circuit pattern is conductive. A firstinsulation layer is disposed on a top surface of the first circuitpattern. Semiconductor chips are disposed on a top surface of the firstinsulation layer. A second insulation layer is disposed on a bottomsurface of the first circuit pattern. A second circuit pattern isdisposed on a bottom surface of the second insulation layer and extendsin the horizontal direction. The second circuit pattern is conductive.The first insulation layer includes a plurality of first protrusionswhich protrude from a bottom surface of the first insulation layer,penetrate through at least a portion of the first circuit pattern, andhave a mesh structure. Second protrusions protrude from the bottomsurface of the first insulation layer, are spaced apart from thesemiconductor chips in the horizontal direction, and penetrate at leasta portion of the first circuit pattern. A horizontal cross-sectionalarea of each of the second protrusions is larger than a horizontalcross-sectional area of each of the first protrusions.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the inventive concept will become moreapparent by describing in detail exemplary embodiments thereof, withreference to the accompanying drawing, in which:

FIG. 1A is a plan view of a semiconductor package according to anexemplary embodiment of the present inventive concept;

FIG. 1B is a cross-sectional view, taken along line I-I′ of FIG. 1A;

FIG. 1C is a cross-sectional view, taken along line II-II′ of FIG. 1A;

FIGS. 2 and 3 are cross-sectional views showing portions of asemiconductor package according to an exemplary embodiment of thepresent inventive concept;

FIGS. 4A, 4B and 4C are cross-sectional views showing a method offabricating a semiconductor package, according to an exemplaryembodiment of the present inventive concept;

FIG. 5A is a block diagram of a semiconductor package, according to anexemplary embodiment of the present inventive concept;

FIGS. 5B and 5C are graphs illustrating an effect of a semiconductorpackage, according to an exemplary embodiment of the present inventiveconcept; and

FIG. 6 is a graph illustrating an effect of a semiconductor package,according to an exemplary embodiment of the present inventive concept.

DETAILED DESCRIPTION OF THE EMBODIMENTS

FIG. 1A is a plan view of a semiconductor package according to anexemplary embodiment of the present inventive concept. FIG. 1B is across-sectional view, taken along line 1-I′ of FIG. 1A. FIG. 1C is across-sectional view, taken along line II-II′ of FIG. 1A.

Referring to FIGS. 1A, 1B and 1C, a semiconductor package 1 may includea package substrate 100, a semiconductor chip 200, and a bonding wire300.

For clarity of description, an upper protective layer 150 of the packagesubstrate 100 is omitted in FIG. 1A. A chip mounting region CMR and anon-mounting region NMR may be defined on the package substrate 100. Thechip mounting region CMR may be in a position corresponding to a regionon the package substrate 100 in which the semiconductor chip 200 ismounted. The non-mounting region NMR may be in a position correspondingto a region on the package substrate 100 in which the semiconductor chip200 is not mounted. The non-mounting region may be defined as a regionoutside the chip mounting region CMR. Thus, the semiconductor chip 200and the non-mounting region NMR may be horizontally separated from eachother. The non-mounting region NMR may include a coefficient of thermalexpansion (CTE) adjusting, region. Although FIG. 1 shows that thepackage substrate 100 includes two CTE adjusting regions CARs, exemplaryembodiments of the present inventive concept are not limited thereto.For example, the package substrate 100 may include one, three, or moreCTE adjusting regions.

Referring to FIG. 1A, the package substrate 100 may be a double-sidedpackage substrate having wires on two surfaces; however, exemplaryembodiments of the present inventive concept are not limited thereto.For example, according to an exemplary embodiment of the presentinventive concept, the package substrate may be a single-sided packagesubstrate having wires on only one surface.

The package substrate 100 may include a base layer 110, a base via 125,an upper conductive pattern 120 a, a lower conductive pattern 120 b, anupper in; layer 130 a, a lower insulation layer 130 b, an upper via 135a, a lower via 135 b, a circuit pattern 140, the upper protective layer150, an upper contact layer 160, a lower protective layer 170, a lowercontact layer 180, and an external connecting terminal 190. According toan exemplary embodiment of the present inventive concept, the packagesubstrate 100 may be a printed circuit board or a flexible substrate.

The base layer 110 may include resin and glass fiber. The resin that maybe included in the base layer 110 may be at least one material selectedfrom among phenol resin, epoxy resin, or polyimide. According to anexemplary embodiment of the present inventive concept, the base layer110 may include a material selected from among Flame Retardant 4 (FR4),tetrafunctional epoxy, polyphenyl ether, epoxy/polyphenylene oxide,bismaleimide triazine (BT), Thermount, cyanate ester, polyimide, aprepreg, an Ajinomoto Build-up Film (ABF) of Ajinomoto Co., Ltd, orliquid crystal polymer. However, exemplary embodiments of the presentinventive concept are not limited thereto. For example, the base layer110 may include silicon oxide, silicon oxynitride, silicon nitride, orany combination thereof. Glass fiber that may be included in the baselayer 110 is one of a number of reinforcing materials and may beprovided by twisting several hundreds of glass filaments having adiameter of from about 5 μm to about 15 μm into fiber bundles andweaving the fiber bundles. The glass filament may be a silica-basedprocessed ore product. The glass fiber may exhibit relatively high heatresistance, mechanical strength, and electrical insulation. However,exemplary embodiments of the present inventive concept are not limitedthereto. According to an exemplary embodiment of the present inventiveconcept, the base layer 110 of the package substrate 100 may be omitted.

The upper conductive pattern 120 a may be disposed on a top surface ofthe base layer 110, and the lower conductive pattern 120 b may bedisposed on a bottom surface of the base layer 110. The upper conductivepattern 120 a and the lower conductive pattern 120 b may each include aconductive material. The upper conductive pattern 120 a and the lowerconductive pattern 120 b may each include at least one selected fromamong copper (Cu), aluminum (Al), nickel (Ni), silver (Ag), gold (Au),platinum (Pt), tin (Sn), lead (Pb), titanium (Ti), chromium (Cr),palladium (Pd), indium (In), zinc (Zn), carbon (C), graphene, or alloysthereof. The upper and lower conductive patterns 120 a and 120 b mayeach include at least a portion having a mesh structure.

The mesh structure may be a structure similar to a mesh network. Themesh structure may be a structure including a plurality of firststraight lines extending substantially in parallel along a firstdirection on one plane, and a plurality of second straight linesextending substantially in parallel along a second directionintersecting the first direction. Distances between adjacent firststraight lines may be substantially the same as each other, butexemplary embodiments of the present inventive concept are not limitedthereto. Distances between adjacent second straight lines may besubstantially the same as each other, but exemplary embodiments of thepresent inventive concept are not limited thereto. The distances betweenthe adjacent first straight lines may be substantially identical to thedistances between the adjacent second straight lines, but exemplaryembodiments of the present inventive concept are not limited thereto.

The upper conductive pattern 120 a and the lower conductive pattern 120b may be connected to each other via the base via 125. The base via 125may penetrate through the base layer 110. A vertical length of the basevia 125 may be substantially identical to a thickness of the base layer110 in the vertical direction. The vertical direction may be a directionorthogonal to a horizontal direction in which the base layer 110extends. The base via 125 may include a conductive material. The basevia 125 may include a material which is the same as that of the upperconductive pattern 120 a, but exemplary embodiments of the presentinventive concept are not limited thereto. The base via 125 may bedisposed in the chip mounting region CMR and the non-mounting regionNMR. The base via 125 is not disposed in the CTE adjusting region CAR.The base via 125 may be horizontally spaced apart from the CTEadjusting,region CAR in the horizontal direction. A horizontal distanceDI between the base via 125 and the CTE adjusting region CAR may beabout three times greater than a diameter DA of the base via 125 (see,e.g., FIG. 1C), but exemplary embodiments of the present inventiveconcept are not limited thereto. The horizontal distance DI between thebase via 125 closest to the CTE adjusting region CAR and the CTEadjusting region CAR may be shorter than the length of each of edges ofthe package substrate 100. For example, the horizontal distance DIbetween the base via 125 closest to the CTE adjusting region CAR and theCTE adjusting region CAR may be shorter than a width of an upper surfaceof the base layer 110 in the horizontal direction. The base layer 110may continuously extend in the CTE adjusting region CAR (e.g., along thehorizontal direction). For example, the base layer 110 may overlapsubstantially the entire CTE adjusting region CAR along a directionorthogonal to the horizontal direction.

The upper insulation layer 130 a may be disposed on a top surface of theupper conductive pattern 120 a. The upper insulation layer 130 a mayinclude a resin. The upper insulation layer 130 a may include at leastone material selected from among phenol resin, epoxy resin, orpolyimide. The upper insulation layer 130 a may include at least onematerial selected from among FR4, tetrafunctional epoxy, polyphenylether, epoxylpolyphenylene oxide, BT, Thermount, cyanate ester,polyimide, or liquid crystal polymer.

The upper insulation layer 130 a may include first insulation layerprotrusions 131 a and a second insulation layer protrusion 133 aprotruding from a bottom surface 130 ab of the upper insulation layer130 a. According to an exemplary embodiment of the present inventiveconcept, the first insulation layer protrusions 131 a and the secondinsulation layer protrusion 133 a may be formed integrally with theupper insulation layer 130 a. However, for clarify of description, thebottom surface 130 ab of the upper insulation layer 130 a will refer toa surface located at a substantially a same level as the top surface ofthe upper conductive pattern 120 a. A top surface 130 bt of the lowerinsulation layer 130 b and a bottom surface 150 b of the upperprotective layer 150, which will be described in more detail below, arealso defined in a similar manner. For example, the top surface 130 bt ofthe lower insulation layer 130 b may refer to a surface located at asubstantially same level as a bottom surface of the lower conductivepattern 120 b, and the bottom surface 150 b of the upper protectivelayer 150 may refer to a surface located at a substantially same levelas a top surface of the circuit pattern 140.

The first insulation layer protrusions 131 a and the second insulationlayer protrusion 133 a may protrude from the bottom surface 130 ab ofthe upper insulation layer 130 a and may at least partially penetratethe upper conductive pattern 120 a. Vertical lengths of the firstinsulation layer protrusions 131 a and the second insulation layerprotrusion 133 a may be substantially identical to a thickness of theupper conductive pattern 120 a. The first insulation layer protrusions131 a and the second insulation layer protrusion 133 a may completelypenetrate through the upper conductive pattern 120 a. For example, thefirst insulation layer protrusions 131 a and the second insulation layerprotrusion 133 a may extend entirely through the upper conductivepattern 120 a along the direction orthogonal to the horizontaldirection. Bottom surfaces of the first insulation layer protrusions 131a and the second insulation layer protrusion 133 a may be in directcontact with the top surface of the base layer 110.

The first insulation layer protrusions 131 a may be disposed in the chipmounting region CMR. However, exemplary embodiments of the presentinventive concept are not limited thereto, and some of the firstinsulation layer protrusions 131 a may be disposed in the non-mountingregion NMR. The first insulation layer protrusions 131 a may have a meshstructure. The portion of the upper conductive pattern 120 a having amesh structure may be in a position corresponding to the firstinsulation layer protrusions 131 a.

The second insulation layer protrusion 133 a may be disposed in the CTEadjusting region CAR. A horizontal cross-sectional area of the secondinsulation layer protrusion 133 a may be greater than a horizontalcross-sectional area of each of the first insulation layer protrusions131 a. As an example, a width of the second insulation layer protrusion133 a in the horizontal direction may be greater than that of the firstinsulation layer protrusions 131 a. The second insulation layerprotrusion 133 a may continuously extend in the CTE adjusting region CAR(e.g., along the horizontal direction). Thus, the second insulationlayer protrusion 133 a may overlap substantially the entire CTEadjusting region CAR along the direction orthogonal to the horizontaldirection. The horizontal cross-sectional area of the second insulationlayer protrusion 133 a may be substantially identical to an area of theCTE adjusting region CAR, but exemplary embodiments of the presentinventive concept are not limited thereto. As an example, a width of thesecond insulation layer protrusion 133 a in the horizontal directiontruly be substantially identical to the width of the CTE adjustingregion CAR. The second insulation layer protrusion 133 a need not have amesh structure.

The lower insulation layer 130 b may be disposed on the bottom surfaceof the lower conductive pattern 120 b. The lower insulation layer 130 bmay include a same material as the upper insulation layer 130 a. Thelower insulation layer 130 b may include third insulation layerprotrusions 131 b and a fourth insulation layer protrusion 133 b.

The third insulation layer protrusions 131 b and the fourth insulationlayer protrusion 133 b may protrude from the top surface 130 bt of thelower insulation layer 130 b and may at least partially penetrate thelower conductive pattern 120 b. Vertical lengths of the third insulationlayer protrusions 131 b and the fourth insulation layer protrusion 133 bmay be substantially identical to a thickness of the lower conductivepattern 120 b. The third insulation layer protrusions 131 b and thefourth insulation layer protrusion 133 b may completely penetratethrough the lower conductive pattern 120 b (e.g., along the directionorthogonal to the horizontal direction). The top surfaces of the thirdinsulation layer protrusions 131 b and the fourth insulation layerprotrusion 133 b may be in direct contact with the bottom surface of thebase layer 110.

The third insulation layer protrusions 131 b may be disposed in the chipmounting region CMR. However, exemplary embodiments of the presentinventive concept are not limited thereto, and some of the thirdinsulation layer protrusions 131 b may be disposed in the non-mountingregion NMR. The third insulation layer protrusions 131 b may have a meshstructure. The portion of the lower conductive pattern 120 b having amesh structure may be in a position corresponding to the thirdinsulation layer protrusions 131 b.

The fourth insulation layer protrusion 133 b may be disposed in the CTEadjusting region CAR. A horizontal cross-sectional area of the fourthinsulation layer protrusion 133 b may be greater than a horizontalcross-sectional area of each of the third insulation layer protrusions131 b. As an example, a width of the fourth insulation layer protrusion133 b in the horizontal direction may be greater than that of each ofthe third insulation layer protrusions 131 b. The fourth insulationlayer protrusion 133 b may continuously extend in the CTE adjustingregion CAR (e.g., in the horizontal direction). The horizontalcross-sectional area of the fourth insulation layer protrusion 133 b maybe substantially identical to the area of the CTE adjusting region CAR,but exemplary embodiments of the present inventive concept are notlimited thereto. As an example, a width of the fourth insulation layerprotrusion 133 b in the horizontal direction may be substantiallyidentical to that of the CTE adjusting region CAR. The fourth insulationlayer protrusion 133 b need not have a mesh structure.

The circuit pattern 140 may be disposed on a top surface of the upperinsulation layer 130 a. The circuit pattern 140 may include a materialwhich is the same as that of the upper conductive pattern 120 a. Thecircuit pattern 140 and the upper conductive pattern 120 a may beconnected to each other via the upper via 135 a. The upper via 135 a maypenetrate through the upper insulation layer 130 a. The lower via 135 bmay penetrate through the lower insulation layer 130 b and may beconnected to the lower conductive pattern 120 b. The upper via 135 a andthe lower via 135 b may include a material which is the same as that ofthe base via 125. Thus, the circuit pattern 140, the upper conductivepattern 120 a and the lower conductive pattern 120 b may be integrallyformed of a same material.

The upper via 135 a and the lower via 135 b may be disposed in the chipmounting region CMR and the non-mounting region NMR. The upper via 135 aand the lower via 135 b are not disposed in the CTE adjusting regionCAR. The upper via 135 a and the lower via 135 b may be horizontallyspaced apart along the horizontal direction from the CTE adjustingregion CAR. The horizontal distance DI between each of the upper via 135a and the lower via 135 b and the CTE adjusting region CAR may be aboutthree times or greater than the diameter DA of each of the upper via 135a and the lower via 135 b, but exemplary embodiments of the presentinventive concept are not limited thereto. The horizontal distance DIbetween the upper via 135 a or the lower via 135 b closest to the CTEadjusting region CAR and the CTE adjusting region CAR may be smallerthan the length of each of edges of the package substrate 100. Forexample, the horizontal distance DI between the upper via 135 a or thelower via 135 b closest to the CTE adjusting region CAR and the CTEadjusting region CAR may be smaller than a width of the packagesubstrate 100 in the horizontal direction. The upper insulation layer130 a and the lower insulation layer 130 b may continuously extend inthe CTE adjusting region CAR. As an example, the upper insulation layer130 a and the lower insulation layer 130 b may overlap substantially theentire CTE adjusting region CAR along the direction orthogonal to thehorizontal direction.

The upper protective layer 150 may be disposed on the circuit pattern140. The upper protective layer 150 may be an insulating coating film.The upper protective layer 150 may be referred to as an insulation layer(e.g., as a first insulation layer). The upper protective layer 150 maybe, for example, a solder resist layer. The upper protective layer 150may include an upper sidewall 155W that defines an upper contact hole155 exposing a portion of the top surface of the circuit pattern 140.The upper protective layer 150 may protect the circuit pattern 140 andprevent a bridge phenomenon between circuit patterns 140.

The upper protective layer 150 may include first protective layerprotrusions 151 and a second protective layer protrusion 153. The firstprotective layer protrusions 151 and the second protective layerprotrusion 153 may protrude from the bottom surface 150 b of the upperprotective layer 150 and may at least partially penetrate the circuitpattern 140 (e.g., along the direction orthogonal to the horizontaldirection). Vertical lengths of the first protective layer protrusions151 and the second protective layer protrusions 153 may be substantiallyidentical to a thickness of the circuit pattern 140. The firstprotective layer protrusions 151 and the second protective layerprotrusion 153 may completely penetrate through the circuit pattern 140.Bottom surfaces of the first protective layer protrusions 151 and thesecond protective layer protrusion 153 may be in direct contact with thetop surface of the upper insulation layer 130 a.

The first protective layer protrusions 151 may be disposed in the chipmounting region. CMR. However, exemplary embodiments of the presentinventive concept are not limited thereto, and some of the firstprotective layer protrusions 151 may be disposed in the non-mountingregion NMR. The first protective layer protrusions 151 may have a meshstructure. A portion of the circuit pattern 140 having a mesh structuremay be in a position corresponding to the first protective layerprotrusions 151.

The second protective layer protrusion 153 may be disposed in the CTEadjusting region CAR. A horizontal cross-sectional area of the secondprotective layer protrusion 153 may he greater than a horizontalcross-sectional area of each of the first protective layer protrusions151. As an example, a width of the second protective layer protrusion153 in the horizontal direction may be greater than that of each of thefirst protective layer protrusions 151. The second protective layerprotrusion 153 may continuously extend in the CTE adjusting region CAR.The horizontal cross-sectional area of the second protective layerprotrusion 153 may be substantially identical to the area of the CTEadjusting region CAR, but exemplary embodiments of the present inventiveconcept are not limited thereto. As an example, a width of the secondprotective protrusion 153 in the horizontal direction may besubstantially identical to that of the CIE adjusting region CAR. Thesecond protective layer 153 need not have a mesh structure.

The upper contact layer 160 may be disposed inside the upper contacthole 155 of the upper protective layer 150. The upper contact layer 160may be connected to the upper via 135 a. The upper sidewall 155W of theupper protective layer 150 defining the upper contact hole 155 may coverside surfaces of the upper contact layer 160. The upper contact layer160 may include a conductive material. The upper contact layer 160 mayinclude at least one selected from among Cu, Al, Ni, Ag, Au, Pt, Sn, PB,Ti, Cr, Pd, In, Zn, C, graphene, or alloys thereof According to anexemplary embodiment of the present inventive concept, when the uppercontact layer 160 includes Ni, it may include phosphor (P), which mayprevent oxidation of Ni included in the upper contact layer 160. Forexample, the upper contact layer 160 may include P at a weight ratio ofabout 5% to about 12%. According to an exemplary embodiment of thepresent inventive concept, a width of the upper contact layer 160 may besmaller than a width of the circuit pattern 140. According to anexemplary embodiment of the present inventive concept, a thickness ofthe upper contact layer 160 may be from about 2 μm to 8 μm (e.g., in thedirection orthogonal to the horizontal direction), but exemplaryembodiments of the present inventive concept are not limited thereto.

The lower protective layer 170 may be provided on a bottom surface ofthe lower insulation layer 130h. The lower protective layer 170 may havea composition which is substantially the same as that of the upperprotective layer 150. The lower protective layer 170 may include a lowersidewall 175W defining a lower contact hole 175 that exposes the bottomsurface of the lower insulation layer 130 b and/or a bottom surface ofthe lower via 135 b.

The lower contact layer 180 may be disposed in the lower contact hole175 of the lower protective layer 170. A top surface of the lowercontact layer 180 may be in direct contact with the lower via 135 band/or the lower insulation layer 130 b. The lower sidewall 175W of thelower protective layer 170 defining the lower contact hole 175 may coverside surfaces of the lower contact layer 180. The lower contact layer180 may include a material which is the same as that of the uppercontact layer 160.

The external connecting terminal 190 may be attached to the lowercontact layer 180. The external connecting terminal 190 may include atleast one selected from among Cu, Al, Ni, Ag, Au, Pt, Sn, PB, Ti, Cr,Pd, In, Zn, C, graphene, or alloys thereof. The external connectingterminal 190 may be, for example, a solder ball or a solder bump. Theexternal connecting terminal 190 may electrically connect thesemiconductor package 1 to an external device. Some of a plurality ofexternal connecting terminals 190 may be provided for signaltransmission, while some others of the plurality of external connectingterminals 190 may be provided to deliver operating power, input/outputpower, or ground potential to the package substrate 100.

While the package substrate 100 may include two insulation layers 130 aand 130 b, three conductive layers 120 a, 120 b, and 140, two protectivelayers 150 and 170, and vias 125, 135 a, and 135 b formed therebetween,exemplary embodiments of the present inventive concept are not limitedthereto. A greater or lower number of each component may be provided,and each component may be modified or omitted, depending on, forexample, the product to which they are applied.

The semiconductor chip 200 may be disposed on the package substrate 100.The semiconductor Chip 200 may be a logic chip, a memory chip, or acombination thereof. When the semiconductor chip 200 is a memory chip,the semiconductor chip 200 may include any of a DRAM, an SRAM, a flashmemory, an EEPROM, a PRAM, an MRAM, and an RRAM. The semiconductorpackage 1 in which such memory chips are mounted on a package substrate100 may be a memory module. Although FIGS. 1A through 1C show that thesemiconductor chip 200 simply has a rectangular shape, the semiconductorchip 200 may be mounted on the package substrate 100 in the form of asealed package sealed by a sealant instead of being mounted on thepackage substrate 100 in the form of a bare chip.

According to an exemplary embodiment of the present inventive concept, abuffer chip may be additionally provided on the package substrate 100.When the semiconductor chip 200 is included in a memory device, thebuffer chip may be disposed between the semiconductor chip 200 and anexternal memory controller and/or an internal memory controller of thesemiconductor package 1 and relay data transmission. For example, thebuffer chip may be an advanced memory buffer (AMB). When the buffer chipis an AMB, the buffer chip may be connected to the semiconductor chip200 mounted in the semiconductor package 1, may store data transmittedfrom the external memory controller and/or the internal memorycontroller of the semiconductor package 1 in the semiconductor chip 200,may read data requested by the external memory controller and/or theinternal memory controller of the semiconductor package 1 from thesemiconductor chip 200, and may transmit the data to the external memorycontroller and/or the internal memory controller of the semiconductorpackage 1. Also, the buffer chip may correspond to a separate bufferchip that transfers the request and storage of data of the memorycontroller to the AMB of the memory module. When a buffer chip isadditionally provided, a memory module having a relatively hightransmission bandwidth and relatively high capacity may be implemented.Alternatively, a buffer chip may be omitted.

While four semiconductor chips may be mounted, exemplary embodiments ofthe present inventive concept are not limited thereto, and one, two,three, or five or more semiconductor chips may be mounted.

Although the package substrate 100 may include the external connectingterminal 190 adjacent to the bottom surface of the package substrate 10,exemplary embodiments of the present inventive concept are not limitedthereto. For example, in an exemplary embodiment of the presentinventive concept, a package substrate may include a connection pin or acontact tab formed in a printed circuit board for a memory module, thepackage substrate being insertable into a slot provided in a mainhoard.In this case, a semiconductor package may correspond to a single in-linememory module (SIMM) in which tabs are disposed on one surface, or adual in-line memory module (DIMM) in which tabs are disposed on twosurfaces.

The bonding wire 300 may electrically interconnect the package substrate100 and the semiconductor chip 200. The bonding wire 300 may include,for example, a conductive material. The bonding wire 300 may include atleast one selected from among Cu, Al, Ni, Ag, Au, Pt, Sn, PB, Ti, Cr,Pd, In, Zn, C, graphene, or alloys thereof. The bonding wire 300 mayelectrically interconnect a top surface of the semiconductor chip 200and the upper contact layer 160 of the package substrate 100. However,exemplary embodiments of the present inventive concept are not limitedthereto, and the semiconductor chip 200 may be provided in the form of aflip-chip on the package substrate 100, in which the semiconductor chip200 may be electrically connected to the package substrate 100 viasolder balls and/or solder bumps.

FIGS. 2 and 3 are cross-sectional views showing portions of asemiconductor package according to an exemplary embodiment of thepresent inventive concept. FIGS. 2 and 3 are cross-sectional views takenalong line II-II′ of FIG. 1A. Descriptions below that would be the sameas those provided above with reference to FIGS. 1A, 1B and 1C may beomitted below.

Referring to FIG. 2, a circuit pattern 140 may extend at least partiallyin the CTE adjusting region CAR. According to an exemplary embodiment ofthe present inventive concept, the circuit pattern 140 may continuouslyextend in the CTE adjusting region CAR. An upper protective layer 150′may include first protective layer protrusions 151′ protruding from abottom surface of the upper protective layer 150′ in the chip mountingregion CMR. According to an exemplary embodiment of the presentinventive concept, the upper protective layer 150′ need not includeprotrusions that protrude from a bottom surface 150 b′ in the CTEadjusting region CAR. However, exemplary embodiments of the presentinventive concept are not limited thereto, and the upper insulationlayer 130 a and/or the lower insulation layer 130 b may be configured soas not to have protrusions in the CTE adjusting region CAR.

Referring to FIG. 3, an upper protective layer 150″ may include firstprotective layer protrusions 151″ and a second protective layerprotrusion 153″ protruding from a bottom surface 150 b″ of the upperprotective layer 150″. A horizontal cross-sectional area of the secondprotective layer protrusion 153″ may be smaller than the area of the CTEadjusting region CAR. As an example, a width of the second protectivelayer protrusion 153″ in the horizontal direction may be smaller thanthat of the CTE adjusting region CAR. However, exemplary embodiments ofthe present inventive concept are not limited thereto.

FIGS. 4A, 4B and 4C are cross-sectional views showing a method offabricating a semiconductor package, according to an exemplaryembodiment of the present inventive concept.

Referring to FIG. 4A, an upper conductive pattern 120 a, a lowerconductive pattern 120 b, and the base via 125 may be formed on the baselayer 110.

The base layer 110 may be provided as a core layer. The composition ofthe base layer 110 may be substantially identical to that described withreference to FIGS. 1A, 1B and 1C. The chip mounting region CMR, thenon-mounting region NMR, and the CTE adjusting region CAR may be definedin the base layer 110. The chip mounting region CMR is a region where asemiconductor chip 200 (see, e.g., FIG. 1A) may be mounted in asubsequent process. The non-mounting region NMR is a region where thesemiconductor chip 200 (see, e.g., FIG. 1A) is not mounted in asubsequent process and may be defined as a region outside the chipmounting region CMR. The CTE adjusting region CAR may be a region fromwhich a conductive material layer described in more detail below isremoved in a subsequent process for adjustment of the CTE.

After a conductive material layer is formed on the top surface of thebase layer 110, the upper conductive pattern 120 a may be provided bypatterning the conductive material layer. Similarly, after a conductivematerial layer is formed on the bottom surface of the base layer 110,the lower conductive pattern 120 b may be provided by patterning theconductive material layer. The conductive material layers may eachinclude conductive materials and may have compositions similar to thatof the upper conductive pattern 120 a described above with reference toFIGS. 1A, 1B and 1C.

Exemplary methods of patterning conductive material layers include asubtractive-type method and an additive-type method. Thesubtractive-type method is a method of removing a portion of a metallayer through, for example, etching and may be used to form a patternhaving a relatively large pitch. Alternatively, the addition-type methodis a method of forming an additional metal pattern on a metal layerthrough, for example, plating and may be used to form a relatively finepattern. A subtractive-type method may be relatively inexpensive ascompared to an additive-type method, and thus a subtractive-typepatterning method may be used for a PCB for a module in which arelatively large pattern is formed. Alternatively, an additive-typepatterning method may be used for a component PCB in which a relativelysmall pattern is formed or a high-cost PCB for a large-scale integratedcircuit (LSI). According to an exemplary embodiment of the presentinventive concept, a subtractive-type patterning method may be used topattern conductive material layers.

According to an exemplary embodiment of the present inventive concept,conductive material layers may be patterned through photolithography.According to an exemplary embodiment of the present inventive concept, alaminate film may be coated on the conductive material layers to coversubstantially an entire surface of the conductive material layers. Next,a mask corresponding to the shapes of the upper and lower conductivepatterns 120 a and 120 b may be formed, and ultraviolet light may beirradiated to the laminated film by using the mask. After theultraviolet irradiation of the laminated film, portions of the laminatedfilm irradiated with ultraviolet rays may be removed through adevelopment process. Next, the conductive material layers may bepatterned by etching exposed portions of conductive material layers byusing the remaining laminate film as an etching mask and then removingthe laminate film. According to an exemplary embodiment of the presentinventive concept, the conductive material layers may be etched throughwet etching, and thus the conductive material layers may have astructure tapered in a depth-wise direction.

Portions of the conductive material layers in the chip mounting regionCMR and some of the non-mounting region NMR may be patterned to form amesh structure. Thus, upper and lower insulation material layers formedin a subsequent process are inserted into openings formed in the upperand lower conductive patterns 120 a and 120 b, thus increasing adhesionbetween an insulating layer and conductive patterns. By reducing contentof a conductive material having a relatively high CTE compared to aninsulation material in the package substrate 100 (see, e.g., FIG. 1A),the CTE of the package substrate 100 (see, e.g., FIG. 1A) may bereduced.

Conductive material layers in the CTE adjusting region CAR may beremoved. Thus, in a final package substrate, a mass ratio of theconductive material in a portion of the package substrate in the CTEadjusting region CAR may be lower than a mass ratio of the conductivematerial in a portion of the package substrate in the chip mountingregion CMR. The mass ratio of the conductive material in the portion ofthe package substrate in the CTE adjusting region CAR may be lower thana mass ratio of the conductive material in a portion of the packagesubstrate in the non-mounting region NMR. The mass ratio of theconductive material in the portion of the package substrate in the CTEadjusting region CAR may be substantially zero, but exemplaryembodiments of the present inventive concept are not limited thereto.The mass ratio of a conductive material in a portion of a packagesubstrate in a specific region refers to a ratio of the mass of theconductive material included in the package substrate in the specificregion to the mass of the entire portion of the package substrate in thespecific region.

The base via 125 may be formed to penetrate through the base layer 110.The base via 125 may be formed by forming a via hole in the upperconductive pattern 120 a, the lower conductive pattern 120 b, and thebase layer 110 via a laser drilling process and then filling the viahole with a conductive material. For example, a CO₂ laser or anyttrium-aluminum-garnet (YAG) laser may be used for the laser drillingprocess. The CO₂ laser has a relatively high power and is used to form ahole penetrating through a relatively thick target layer, whereas theYAG laser has a relatively low power and may be used to partially drilla target layer. However, exemplary embodiments of the present inventiveconcept are not limited thereto, and a chemical etching method may beused when the upper conductive pattern 120 a and the lower conductivepattern 120 b are relatively thick. The base via 125 may includematerials which are the same as those described above with reference toFIGS. 1A, 1B and 1C. The base via 125 may be formed so as to beconnected to the upper conductive pattern 120 a and the lower conductivepattern 120 b.

Referring to FIG. 4B, the upper insulation layer 130 a, the lowerinsulation layer 130 b, a circuit pattern 145, the upper via 135 a, andthe lower via 135 b may be provided.

An upper insulation material layer may be formed on the top surface ofthe upper conductive pattern 120 a and a lower insulation material layermay be formed on the bottom surface of the lower conductive pattern 120b. The upper insulation layer 130 a and the lower insulation layer 130 bmay be formed by curing the upper insulation material layer and thelower insulation material layer. At this time, since the upper and lowerinsulation material layers are pressed onto the upper conductive pattern120 a and the lower conductive pattern 120 b through a pressing process,portions of the upper and lower insulation material layers may beinserted into the space between the upper conductive pattern 120 a andthe lower conductive pattern 120 b. Thus, first through fourthinsulation layer protrusions 131 a, 133 a, 131 b, and 133 b may beformed. The upper insulation material layer and the lower insulationmaterial layer may include an insulation material, e.g., a materialwhich is the same that of the upper insulation layer 130 a (see, e.g.,FIG, 1A) described above with reference to FIGS. 1A, 1B and 1C.

The circuit pattern 140 may be positioned relative to the upper andlower conductive patterns 120 a and 120 b as described above withreference to FIG. 1A. The circuit pattern 140 may include a conductivematerial. As an example, the circuit pattern 140 may include materialswhich are the same as those described above with reference to FIGS. 1A,1B and 1C.

The upper via 135 a penetrating through the upper insulation layer 130 aand connected to the upper conductive pattern 120 a and the circuitpattern 140 and a lower via 135 b penetrating through the lowerinsulation layer 130 b and connected to the lower conductive pattern 120b may be formed. The compositions of the upper and lower vias 135 a and135 b may be the same as described above with reference to FIGS. 1A, 1Band 1C. The upper and lower vias 135 a and 135 b may be formed using amethod similar to the method of forming the base via 125 described abovewith reference to FIG. 4A.

Referring to FIG. 4C, upper and lower protective material layers 157 and177 may be formed. The upper protective material layer 157 may be formedon the circuit pattern 140 and the lower protective material layer 177may be formed on the bottom surface of the lower insulation layer 130 b.According to an exemplary embodiment of the present inventive concept,the upper and lower protective material layers 157 and 177 may be formedthrough a photo solder resist (PSR) process. The PSR process may be aprocess for coating a permanent ink on a patterned circuit to protectthe circuit and prevent a bridge phenomenon between the circuit andsolders in subsequent processes including a surface treatment processand a component mounting process. After the upper protective materiallayer 157 is formed, the upper contact hole 155 (see, e.g., FIG. 1B) maybe formed to expose at least a portion of the top surface of the circuitpattern 140 by etching the upper protective material layer 157. Afterthe lower protective material layer 177 is formed, the lower contacthole 175 (see, e.g., FIGS. 1B and 1C) may be formed to expose at least aportion of a bottom surface of the lower via 135 b or at least a portionof the bottom surface of the lower insulation layer 130 b by etching thelower protective material layer 177. The upper and lower contact holes155 and 175 (see, e.g., FIG. 1B) may be formed substantiallysimultaneously, but exemplary embodiments of the present inventiveconcept are not limited thereto o.

Referring again to FIGS. 1B and IC, the upper contact layer 160 may beformed on a portion of the circuit pattern 140 exposed by the uppercontact hole 155. Side surfaces of the upper contact layer 160 may becovered by the upper sidewall 155W of the upper contact hole 155. Theupper contact layer 160 may be formed through non-electrolytic platingand/or electrolytic plating. According to an exemplary embodiment of thepresent inventive concept, to form the upper contact layer 160, afternon-electrolytic plating is performed, electrolytic plating may beperformed by using a layer formed through the non-electrolytic platingas a seed layer. The upper contact layer 160 may include P to preventoxidation of Ni included in the upper contact layer 160. For example,the upper contact layer 160 may include P at a weight ratio of about 5%to about 12%.

The lower contact layer 180 (see, e.g., FIGS. 1B and IC) may be formedon at least a portion of the bottom surface of the lower via 135 band/or at least a portion of the bottom surface of the lower insulationlayer 130 b exposed by the lower contact hole 175. Side surfaces of thelower contact layer 180 may be covered by the lower sidewall 175W of thelower contact hole 175. A portion of the lower contact layer 180 may beconnected to the lower via 135 b. The lower contact layer 180 may beformed in a similar mariner to that by which the upper contact layer 160is formed. According to an exemplary embodiment of the present inventiveconcept s, the upper contact layer 160 and the lower contact layer 180may be formed substantially simultaneously, but exemplary embodiments ofthe present inventive concept are not limited thereto.

The semiconductor chip 200 may be provided on the upper protective layer150, and the top surface of the semiconductor chip 200 may be connectedto the upper contact layer 160 through the bonding wire 300. When thesemiconductor chip 200 is provided on the upper protective layer 150, adie attach film (DAF) may be provided at a position on the upperprotective layer 150 where the semiconductor chip 200 is to be providedand the semiconductor chip 200 may be bonded thereto. However, exemplaryembodiments of the present inventive concept are not limited thereto,and the semiconductor chip 200 may be provided in the form of a flipchip and connected to the package substrate 100 via solder bumps and/orsolder balls.

The external connecting terminal 190 may be provided on the lowercontact layer 180. The external connecting terminal 190 may be a solderball or a solder bump. The external connecting terminal 190 may beformed in a reflow process after providing a solder material throughelectrolytic plating, non-electrolytic plating, CVD, or PVD. Thecomposition of the external connecting terminal 190 may be the same asthat described above with reference to FIGS. 1A, 1B and 1C.

According to an exemplary embodiment of the present inventive concept,the base layer 110, the upper insulation layer 130 a, the lowerinsulation layer 130 b, the upper protective layer 150, the lowerprotective layer 170, the lower contact layer 180, and the externalconnecting terminal 190 may be formed in the CTE adjusting region CAR.The base via 125 and the upper and lower via 135 a and 135 b need not bedisposed in the CTE adjusting region CAR. The upper conductive pattern120 a, the lower conductive pattern 120 b, and the circuit pattern 140need not be formed in the CTE adjusting region CAR. Thus, thesemiconductor package 1, in which the mass ratio of a conductivematerial included in the package substrate 100 is reduced, may beprovided.

In a package substrate, when a circuit pattern or vias include(s) aconductive material, e.g., copper, the effective CTE (E-CTE) of theentire package substrate also increases due to the high CTEcharacteristics of the conductive material. Here, the E-CTE of thepackage substrate may be an average CTE applied to the entire packagesubstrate, which is calculated in consideration of respective CTEs andratios of various components included in the package substrate. Thus, toreduce the E-CTE of a package substrate, the amount of a conductivematerial may be reduced.

In this case, since a power/ground region occupies a relatively largeproportion of a conductive material included in a package substrate,reducing an amount of the conductive material included in thepower/ground region is effective in enhancing the E-CTE characteristic.Thus, the thickness or the area of a pattern or a via including theconductive material may be reduced. However, in this case, signalintegrity/power integrity (SI/PI) characteristics may deteriorate.

According to an exemplary embodiment of the present inventive concept,conductive materials in the power/ground region that does not operate asa signal transmission path in a package substrate design of the priorart may be selectively removed to prevent deterioration of theelectrical properties of a package substrate. Here, the power/groundregion refers to a region for providing operation power, input/outputpower, and/or ground potential of a semiconductor package. Such asemiconductor package is described in more detail below with referenceto FIG. 5A. Furthermore, the signal transmission path may correspond tothe shortest path from among paths for signal transmission from anactive surface of the semiconductor chip 200 to each of the externalconnecting terminals 190. Thus, the conductive materials included in theshortest signal transmission paths are not removed, and the SIcharacteristic might not be deteriorated. Here, the active surface maybe a surface of the semiconductor chip 200 on which an externalconnection pad is formed. For example, in the case of the semiconductorchip 200 described in more detail above with reference to FIGS. 1A, 1Band 1C, an active surface thereof may be a surface facing in the samedirection as the top surface of the package substrate 100, that is, thetop surface of the semiconductor chip 200. According to an exemplaryembodiment of the present inventive concept, when a semiconductor chipis provided as a flip chip, the active surface of the semiconductor chipmay be the bottom surface.

According to an exemplary embodiment of the present inventive concept,when conductive materials are removed, a conductive material in thepower/ground region may be removed except for the conductive material ina main power path. Here, the main power path may correspond to theshortest path from among paths from the upper contact layer 160 to theexternal connecting terminals 190 for power/ground. Thus, a conductivematerial layer other than a portion corresponding to the main powerpath, which is a region of a pre-designed power/ground region mainlydetermining inductance, may be selectively removed, thus reducing themass ratio of a conductive material of the package substrate 100.Therefore, the conductive material in a region not determining theinductance of the power/ground region in a pre-designed power/groundregion may be selectively removed, thus reducing or eliminatingdeterioration of the PI characteristics.

In a package substrate according to an exemplary embodiment of thepresent inventive concept, an amount of a conductive material may bereduced by about 7% relative to a conventional package substrate,without deterioration of electrical characteristics, such as electricalconductivity. Thus, according to an exemplary embodiment of the presentinventive concept, a package substrate with a reduced E-CTE may beprovided without deterioration of electrical characteristics.

FIG. 5A is a block diagram of a semiconductor package, according to anexemplary embodiment of the present inventive concept.

FIGS. 5B and 5C are graphs illustrating an effect of a semiconductorpackage, according to an exemplary embodiment of the present inventiveconcept.

Referring to FIG. 5A, first through fourth signal transmitting regionsSR1, SR2, SR3, and SR4 may be defined on the package substrate 100,which may substantially equally divide the package substrate 100 intofour portions. According to an exemplary embodiment of the presentinventive concept, when the package substrate 100 has a substantiallyrectangular shape, the first through fourth signal transmitting regionsSR1, SR2, SR3, and SR4 may correspond to four substantially rectangularportions which are regions into which the package substrate 100 isdivided. According to an exemplary embodiment of the present inventiveconcept, the first through fourth signal transmitting regions SR1, SR2,SR3, and SR4 may be four regions that pass through the center of thepackage substrate 100 and are separated from one another by two linesegments that are substantially parallel to two pairs of edges of thepackage substrate 100 and substantially perpendicular to each other.

Each of the first through fourth signal transmitting regions SR1, SR2,SR3, and SR4 may include first through fifth power/ground regions PR1,PR2, PR3, PR4, and PR5. The first through fifth power/ground regionsPR1, PR2, PR3, PR4, and PR5 may provide central power, provide input andoutput power, and/or provide ground potential. According to an exemplaryembodiment of the present inventive concept, first and secondpower/ground regions PR1 and PR2 may provide power for operation of thesemiconductor package 1 (see, e.g., FIG. 1A). According to an exemplaryembodiment of the present inventive concept, the third and fourthpower/ground regions PR3 and PR4 may provide power for input/output ofthe semiconductor package 1. According to an exemplary embodiment of thepresent inventive concept, the fifth power/ground region PR5 may providea ground potential.

While first through fifth power/ground regions PR1, PR2, PR3, PR4, andPR5 may be formed adjacent to edges of the first signal transmittingregion SR1, exemplary embodiments of the present inventive concept arenot limited thereto. Furthermore, although the first through fifthpower/ground regions PR1, PR2, PR3, PR4, and PR5 may be substantiallyrectangular regions, this is an example, and exemplary embodiments ofthe present inventive concept are not limited thereto. As an example,the first through fifth poorer/ground regions PR1, PR2, PR3, PR4, andPR5 may have various arrangements and shapes.

Referring to FIGS. 5A and 5B, an exemplary average values of inductancesof the main power paths of the first through fifth power/ground regionsPR1, PR2, PR3, PR4, and PR5 of a package substrate of the prior art anda package substrate according to an exemplary embodiment of the presentinventive concept are illustrated. The inductance of the main power pathof the semiconductor package according to an exemplary embodiment of thepresent inventive concept may be substantially equivalent to that of thepackage substrate of the prior art. As described above with reference toFIGS. 1A, 1B and 1C, the main power path is the shortest path from amongpaths from the upper contact layer 160 (see, e.g., FIG. 1B) to each ofthe external connecting terminals 190 for power/ground (see, e.g., FIG.1B). According to an exemplary embodiment of the present inventiveconcept, since a conductive material in portions not corresponding tothe main power path is selectively removed, the electricalcharacteristics of the first through fifth power/ground regions PR1,PR2, PR3, PR4, and PR5 of the package substrate do not deteriorate.

Referring to FIG. 5C, exemplary values of the mutual inductances ofsignal transmission paths of a package substrate of the prior art and apackage substrate according to an exemplary embodiment of the presentinventive concept are shown as average values of the first throughfourth signal transmitting regions SR1, SR2, SR3, and SR4. The signaltransmission path corresponds to the shortest path from among paths froman active surface of the semiconductor chip 200 to each of the externalconnecting terminals 190 for signal transmission, as described forexample with reference to FIGS. 1A, 1B and 1C. According to an exemplaryembodiment of the present inventive concept, since a conductive materialin portions not corresponding to the signal transmission path isselectively removed, respective average values of the mutual inductancesof the signal transmission paths of the semiconductor package in thefirst to fourth signal transmission regions SR1, SR2, SR3 and SR4 may besubstantially equal to the that of the conventional package substrate.Thus, electrical characteristics (e.g., electrical conductivity) of thefirst through fourth signal transmitting regions SR1, SR2, SR3, and SR4of the semiconductor package according to an exemplary embodiment of thepresent inventive concept are not deteriorated.

FIG. 6 is a graph illustrating an effect of a semiconductor package,according to an exemplary embodiment of the present inventive concept.

Referring to FIG, 6, there are shown exemplary E-CTEs of a semiconductorpackage of the prior art and a package substrate according to anexemplary embodiment of the present inventive concept, according, totemperature intervals. A first temperature interval TI1 may be fromabout 25° C. to about 100° C. A second temperature interval T12 may befrom about 200° C. to about 250° C. According to an exemplary embodimentof the present inventive concept, the E-CTE of the package substrate maybe reduced by about 2.7% relative to that of the semiconductor packageof the prior art in the first temperature interval TI1. According to anexemplary embodiment of the present inventive concept, the E-CTE of thepackage substrate may be reduced by about 8% relative to that of thesemiconductor package of the prior art in the second temperatureinterval TI2.

While the present inventive concept has been particularly shown anddescribed with reference to exemplary embodiments thereof, it will beunderstood that various changes in form and details may be made thereinwithout departing from the spirit and scope of the present inventiveconcept.

What is claimed is:
 1. A semiconductor package comprising: a circuitpattern extending in a horizontal direction, wherein the circuit patternis conductive; a first insulation layer disposed on the circuit pattern;and a semiconductor chip disposed on the first insulation layer, whereinthe first insulation layer comprises: first protrusions which protrudefrom a bottom surface of the first insulation layer, penetrate throughat least a portion of the circuit pattern, and have a mesh structure;and a second protrusion which protrudes from the bottom surface of thefirst insulation layer and penetrates at least a portion of the circuitpattern within coefficient of thermal expansion (CTE) adjusting regionof the semiconductor package, wherein the second protrusion is spacedapart from the semiconductor chip in the horizontal direction, andwherein the second protrusion has a width in the horizontal directionwider than that of each of the first protrusions.
 2. The semiconductorpackage of claim 1, wherein at least some of the first protrusions arearranged below the semiconductor chip.
 3. The semiconductor package ofclaim 1, wherein the second protrusion does not have a mesh structure.4. The semiconductor package of claim 1, wherein the first protrusionsand the second protrusion have structures tapered in a depth-wisedirection orthogonal to the horizontal direction.
 5. The semiconductorpackage of claim 1, further comprising: a second insulation layerdisposed on a bottom surface of the circuit pattern and extending in thehorizontal direction; and vias penetrating through the second insulationlayer in. a vertical direction orthogonal to the horizontal directionand connected to the circuit pattern.
 6. The semiconductor package ofclaim 5, wherein the second protrusion is spaced apart from the vias inthe horizontal direction.
 7. The semiconductor package of claim 5,wherein a horizontal distance between a via closest to the secondprotrusion from among the vias and the second protrusion is three timesor greater than a diameter of each of the vias.
 8. A semiconductorpackage comprising: a package substrate having a chip mounting regionand a non-mounting region defined by the chip mounting region, whereinthe package substrate comprises: a circuit pattern which extends in thechip mounting region and the non-mounting region in a horizontaldirection and comprises a conductive material; an insulation layerdisposed on the circuit pattern; and a semiconductor chip disposed onthe package substrate in the chip mounting region, wherein thenon-mounting region comprises a coefficient of thermal expansion (CTE)adjusting region, and a mass ratio of a mass of the conductive materialin a portion of the package substrate in the CTE adjusting region to atotal mass of the package substrate in the portion of the packagesubstrate in the CTE adjusting region is smaller than a mass ratio of amass of the conductive material in a portion of the package substrate inthe chip mounting region to a total mass of the package substrate in theportion of the package substrate in the chip mounting region.
 9. Thesemiconductor package of claim 8, wherein the mass ratio of theconductive material in a portion of the package substrate in the CTEadjusting region is smaller than a mass ratio of the conductive materialin a portion of the package substrate in the non-mounting region. 10.The semiconductor package of claim 8, wherein the conductive material iscopper (Cu).
 11. The semiconductor package of claim 9, wherein thecircuit pattern does not extend in the CTE adjusting region.
 12. Thesemiconductor package of claim 9, wherein the insulation layer isarranged across substantially an entire width of the CTE adjustingregion in the horizontal direction.
 13. The semiconductor package ofclaim 9, wherein the insulation layer comprises: a first protrusionprotruding from a bottom surface of a portion of the insulation layer inthe chip mounting region; and a second protrusion protruding from abottom surface of a portion of the insulation layer in the CTE adjustingregion, and a width of the second protrusion is larger than a width ofthe first protrusion in the horizontal direction.
 14. The semiconductorpackage of claim 13, wherein the width of the second protrusion issubstantially identical to a width of the CTE adjusting region in thehorizontal direction.
 15. A semiconductor package comprising: a firstcircuit pattern extending in a horizontal direction, the first circuitpattern being conductive; a first insulation layer disposed on a topsurface of the first circuit pattern; semiconductor chips disposed on atop surface of the first insulation layer; a second insulation layerdisposed on a bottom surface of the first circuit pattern; and a secondcircuit pattern disposed on a bottom surface of the second insulationlayer and extending in the horizontal direction, the second circuitpattern being conductive, wherein the first insulation layer comprises:a plurality of first protrusions which protrude from a bottom surface ofthe first insulation layer, penetrate through at least a portion of thefirst circuit pattern, and have a mesh structure; and second protrusionswhich protrude from the bottom surface of the first insulation layer,are spaced apart from the semiconductor chips in the horizontaldirection, and penetrate at least a portion of the first circuit patternwithin a coefficient of thermal expansion (CTE) adjusting region of thesemiconductor package, and wherein a horizontal cross-sectional area ofeach of the second protrusions is larger than a horizontalcross-sectional area of each of the first protrusions.
 16. Thesemiconductor package of claim 15, further comprising first vias whichpenetrate through the second insulation layer in a vertical directionand interconnect the first circuit pattern and the second circuitpattern, and wherein a horizontal distance between a first via closestto the second protrusions from among the first vias and the secondprotrusion is three times or greater than a diameter of each of thefirst vias.
 17. The semiconductor package of claim 15, wherein thesecond insulation layer comprises: a plurality of third protrusionswhich protrude from the bottom surface of the second insulation layer,penetrate through at least a portion of the second circuit pattern, andhave a mesh structure; and fourth protrusions which protrude from thebottom surface of the second insulation layer, are spaced apart frontthe semiconductor chips in the horizontal direction, and penetrate atleast a portion of the second circuit pattern, and wherein a horizontalcross-sectional area of each of the fourth protrusions is larger than ahorizontal cross-sectional area of each of the third protrusions. 18.The semiconductor package of claim 17, wherein the second protrusionsand the fourth protrusions overlap each other in a vertical directionorthogonal to the horizontal direction.
 19. The semiconductor package ofclaim 17, wherein vertical thicknesses of the first and secondprotrusions are substantially identical to a vertical thickness of thefirst circuit pattern.
 20. The semiconductor package of claim 17,wherein the horizontal cross-sectional area of each of the secondprotrusions is different from the horizontal cross-sectional area ofeach of the fourth protrusions.